Diodes Incorporated DI5315-02F

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8536.30.80.00

Automotive

No

PPAP

No

Direction Type

Uni-Directional

Number of Elements per Chip

2

Maximum Working Voltage (V)

5

Minimum Breakdown Voltage (V)

6.5

Maximum Breakdown Voltage (V)

9

Maximum Clamping Voltage (V)

21

Maximum Peak Pulse Current (A)

3

Maximum Leakage Current (uA)

0.5

Test Current (mA)

1

Peak Pulse Power Dissipation (W)

60

Minimum Operating Temperature (°C)

-50

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Commercial

Mounting

Surface Mount

Package Height

0.35(Max)

Package Width

1

Package Length

0.6

PCB changed

3

Supplier Package

DFN

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Diode Array

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Dual