Dialog DA9063-00HO2

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

100

Moisture Sensitive

Yes

Factory Pack QuantityFactory Pack Quantity

5000

Manufacturer

Dialog Semiconductor

Brand

Dialog Semiconductor

RoHS

Details

Package Description

TFBGA, BGA100,10X10,32

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA100,10X10,32

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

Yes

Manufacturer Part Number

DA9063-00HO2

Supply Voltage-Nom (Vsup)

3.6 V

Package Code

TFBGA

Package Shape

SQUARE

Part Life Cycle Code

Active

Ihs Manufacturer

DIALOG SEMICONDUCTOR GMBH

Risk Rank

5.68

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Subcategory

PMIC - Power Management ICs

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

JESD-30 Code

S-PBGA-B100

Supply Voltage-Max (Vsup)

5.5 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

Number of Channels

33

Analog IC - Other Type

POWER SUPPLY MANAGEMENT CIRCUIT

Adjustable Threshold

YES

Seated Height-Max

1.2 mm

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Power Management Specialized - PMIC

Product Category

a particular group of related products.

Power Management Specialized - PMIC

Width

8 mm

Length

8 mm