13844

Desco 13844

Part No:

13844

Manufacturer:

Desco

Datasheet:

-

Package:

300

AINNX NO:

7913535-13844

Description:

DESICCANT PAK PAIL 300

Products specifications
  • Factory Lead Time
    10 Weeks
  • Package / Case
    300
  • Weight
    11.793402kg
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Pail of Individual Packets
  • Series
    Desi Pak®
  • Published
    2012
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Usage
    Moisture Absorption
  • Shelf Life
    36 Months
  • Shelf Life Start
    Date of Manufacture
  • Specifications

    a measure of a material's ability to?conduct heat.?

    Montmorillonite Clay
  • Quantity
    300 (4 L x 2 W)
  • Cleaner, Treatment Type
    Desiccant
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free
    Lead Free
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