Davies Molding, LLC 0230-A

Factory Lead Time

8 Weeks

Mount

Box

Material

Plastic, Phenolic

Housing Material

Phenolic

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

0230

Published

2016

Size / Dimension

5.010Lx4.250W 127.25mmx107.95mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Color

Black

Design

Open End(s)

Container Type

Box

Area (L x W)

21.3in2 (137cm2)

Features

Heat Resistant

Height

1.750 44.45mm

Width

107.95mm

Thickness

0.130 3.30mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant