Davies Molding, LLC 0230

Factory Lead Time

8 Weeks

Mount

Box

Material

Plastic, Phenolic

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

5.000Lx4.250W 127.00mmx107.95mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Color

Black

Container Type

Case

Area (L x W)

21.3in2 (137cm2)

Features

Heat Resistant

Height

1.750 44.45mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant