Davies Molding, LLC 0210-A

Factory Lead Time

8 Weeks

Mount

Box

Material

Plastic, Phenolic

Housing Material

Phenolic

Published

2016

Series

0210

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

3.510Lx2.510W 89.15mmx63.75mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Color

Black

Design

Open End(s)

Container Type

Box

Area (L x W)

8.79in2 (56.7cm2)

Features

Heat Resistant

Width

63.75mm

Height

1.260 32.00mm

Thickness

0.098 2.50mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant