Dantona Industries CR2032-TPX

Lead Free Status / RoHS Status

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CCT(K)

4000K 3-Step MacAdam Ellipse

Series

Vero® 18 Array

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

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Size / Dimension

36.20mm Diameter

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

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Type

Chip On Board (COB)

Color

White, Neutral

Configuration

Round

Voltage - Forward (Vf) (Typ)

29.5V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

120°

Current - Test

1.05A

Lumens/Watt @ Current - Test

129 lm/W

CRI (Color Rendering Index)

80

Current - Max

2.1A

Lens Type

Lenses are classified by the curvature of the two optical surfaces. A lens is biconvex (or double convex, or just convex) if both surfaces are convex. If both surfaces have the same radius of curvature, the lens is equiconvex. A lens with two concave surfaces is biconcave (or just concave).

Flat

Flux @ Current/Temperature - Test

3990 lm (Typ)

Light Emitting Surface (LES)

18.40mm Diameter

Wavelength

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Features

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Height

1.90mm