CY8C20496A-24LQXI

Cypress Semiconductor Corp CY8C20496A-24LQXI

Part No:

CY8C20496A-24LQXI

Datasheet:

CY8C20336H/446H

Package:

32-UFQFN Exposed Pad

ROHS:

AINNX NO:

7626231-CY8C20496A-24LQXI

Description:

MCU 16K FLASH 2K SRAM 32QFN

Products specifications
  • Factory Lead Time
    8 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Mounting Type
    Surface Mount
  • Package / Case
    32-UFQFN Exposed Pad
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    32
  • Memory Types
    FLASH
  • Number of I/Os
    28
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    CapSense® Controllers
  • Published
    2003
  • JESD-609 Code
    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    32
  • ECCN Code
    EAR99
  • Applications
    Capacitive Sensing
  • Voltage - Supply
    1.71V~5.5V
  • Terminal Position
    QUAD
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3V
  • Frequency
    24MHz
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    CY8C20496
  • Pin Count

    a count of all of the component leads (or pins)

    32
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.8/5V
  • Interface
    I2C, SPI, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    16kB
  • RAM Size
    2K x 8
  • Core Processor
    M8C
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH (16kB)
  • Bit Size
    8
  • Data Bus Width
    8b
  • Number of Timers/Counters
    3
  • Resolution
    1.25 B
  • CPU Family
    M8C
  • Boundary Scan
    NO
  • Sensing Method
    Capacitive
  • Number of Programmable I/O
    22
  • Conversion Rate

    the number of conversions divided by the total number of visitors.

    5.85 ksps
  • RAM (words)
    2000
  • Bus Compatibility
    USB
  • Number of GPIO
    25
  • Controller Series
    CY8C20xx6A
  • Height
    530μm
  • Length
    5mm
  • Width
    5mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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