CY3250-20334QFN

Cypress Semiconductor Corp CY3250-20334QFN

Part No:

CY3250-20334QFN

Datasheet:

CY8C20(2,3,4)34

Package:

QFN

AINNX NO:

4949037-CY3250-20334QFN

Category:

Accessories

Description:

KIT ICE POD FOR CY8C20334 QFN

Products specifications
  • Package / Case
    QFN
  • Number of Pins
    24
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Series
    PSoC®
  • Published
    2006
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Accessory Type
    Emulator Flex Pod Kit
  • Evaluation Kit
    Yes
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free
    Lead Free
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