Cypress Semiconductor IS29GL128S-90DHI02

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

64

Supply Voltage-Nom (Vsup)

3 V

Package Style

GRID ARRAY, LOW PROFILE

Package Shape

SQUARE

Package Code

LBGA

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Number of Words Code

16000000

Number of Words

16777216 words

Access Time-Max

90 ns

Risk Rank

5.71

Package Description

LBGA,

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Part Life Cycle Code

Active

Manufacturer Part Number

IS29GL128S-90DHI02

Type

NOR TYPE

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

unknown

JESD-30 Code

S-PBGA-B64

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

2.7 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Organization

16MX8

Seated Height-Max

1.4 mm

Memory Width

8

Memory Density

134217728 bit

Parallel/Serial

PARALLEL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

3 V

Boot Block

BOTTOM/TOP

Width

9 mm

Length

9 mm