Cypress CYONS1001T0-LBXC

Mounting Type

Through Hole

Manufacturer

BARKER MICROFARADS INC

RoHS

Y

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

POLYESTER SLEEVE WITH EPOXY END SEAL

Size / Dimension

0.875in D x 1.625in L, Nominal Case Size

Tolerance

-10%/+50% (std.)

Capacitance

2,700uF

Lead Spacing

the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

1.25in

Voltage

25V

Ripple Current

the pulsed current consumption of non-linear devices like capacitor-input rectifiers.

2.98Arms, +85°C at 120Hz

ESR

0.076-ohm, +25°C at 120Hz