CUI Inc. VLD25-600-DIP

Factory Lead Time

10 Weeks

Package / Case

6-DIP Module

Mounting Type

Through Hole

Mount

Through Hole

Weight

0.009lb 4.08g

Published

2016

Series

VLD25-DIP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~71°C

Size / Dimension

0.90Lx0.40W x 0.37 H 22.9mmx10.2mmx9.5mm

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Constant Current

Power (Watts)

22W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

22W

Number of Outputs

1

Approval Agency

CE, EN, IEC

Efficiency

95%

Voltage - Input (Max)

46V

Max Output Current

The maximum current that can be supplied to the load.

600mA

Voltage - Input (Min)

5.5V

Voltage - Output

3.3V~36V

Topology

Buck

Dimming

Analog, PWM

Features

Remote On/Off, SCP

Height

9.398mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free