APR27-27-1232/A01/T

CTS Corporation APR27-27-1232/A01/T

Part No:

APR27-27-1232/A01/T

Manufacturer:

CTS Corporation

Datasheet:

-

Package:

-

AINNX NO:

56516072-APR27-27-1232/A01/T

Description:

Heat Sinks Fin Mat. 8 X 8 Snap On

Products specifications
  • Factory Pack QuantityFactory Pack Quantity
    10
  • Mounting Styles
    Snap On
  • Manufacturer
    CTS
  • Heatsink Material
    Aluminum
  • Brand
    CTS Electronic Components
  • RoHS
    Details
  • Designed for
    BGA
  • Series
    APR
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Subcategory
    Heat Sinks
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Heat Sinks
  • Product Category

    a particular group of related products.

    Heat Sinks
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