APR27-27-1232/A01/T
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56516072-APR27-27-1232/A01/T
Heat Sinks Fin Mat. 8 X 8 Snap On
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.