Cooper Industries CTX750-1-52-R

Number of Terminals

2

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Powdered Iron

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Inductance (H)

754.4u(OCL)/750u

Inductance Test Frequency (Hz)

100K

Maximum DC Current (A)

1.8

Maximum DC Resistance (Ohm)

0.434

Mounting

Through Hole

Terminal Pitch (mm)

28.2

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Product Diameter (mm)

29.8

Product Depth (mm)

17.4

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

20%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Power

Lead Style

Radial