Cooper Industries CTX50-5-52-R

Number of Terminals

2

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Powdered Iron

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Inductance (H)

49.6u(OCL)/50u

Inductance Test Frequency (Hz)

100K

Maximum DC Current (A)

7.6

Maximum Saturation Current (A)

9.4

Maximum DC Resistance (Ohm)

0.0248

Mounting

Through Hole

Terminal Pitch (mm)

16.5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Product Diameter (mm)

32.3

Product Depth (mm)

18.9

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

20%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Power

Lead Style

Radial