POE4W3X3.3-R

Cooper Bussmann POE4W3X3.3-R

Part No:

POE4W3X3.3-R

Manufacturer:

Cooper Bussmann

Datasheet:

-

Package:

-

AINNX NO:

45751525-POE4W3X3.3-R

Description:

Products specifications
  • Mount
    Through Hole
  • Mounting Type
    Surface Mount
  • RoHS
    Non-Compliant
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Other Names
    POE4W3X3-3-R
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Series
    PoE
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Size / Dimension
    0.673 L x 0.630 W (17.10mm x 16.00mm)
  • Tolerance
    20 %
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Configurable (For DC/DC)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    105 °C
  • Min Operating Temperature
    -55 °C
  • Applications
    Power Over Ethernet (PoE)
  • Capacitance
    82 µF
  • Frequency
    250kHz
  • Lead Pitch
    3.5 mm
  • Voltage - Isolation
    1500Vrms
  • Ripple Current

    the pulsed current consumption of non-linear devices like capacitor-input rectifiers.

    320 mA
  • Voltage - Primary
    -
  • Inductance @ Frequency
    200µH @ 100kHz
  • Footprint
    0.673 L x 0.935 W (17.10mm x 23.74mm)
  • Chipset Manufacturer
    -
  • Voltage - Auxiliary
    -
  • Intended Chipset

    In a computer system, a chipset is a set of electronic components in an integrated circuit known as a "Data Flow Management System" that manages the data flow between the processor, memory and peripherals. It is usually found on the motherboard. Chipsets are usually designed to work with a specific family of microprocessors. Because it controls communications between the processor and external devices, the chipset plays a crucial role in determining system performance.

    -
  • Height Seated (Max)
    0.341 (8.65mm)
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