POE13W3VERS-R

Cooper Bussmann POE13W3VERS-R

Part No:

POE13W3VERS-R

Manufacturer:

Cooper Bussmann

Datasheet:

-

Package:

-

AINNX NO:

45751526-POE13W3VERS-R

Description:

Products specifications
  • Mounting Type
    Surface Mount
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Other Names
    513-1107-2 POE13W3VERS
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Series
    PoE
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Size / Dimension
    0.709 L x 0.709 W (18.00mm x 18.00mm)
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Configurable (For DC/DC)
  • Applications
    Power Over Ethernet (PoE)
  • Frequency
    250kHz
  • Voltage - Isolation
    1500Vrms
  • Voltage - Primary
    -
  • Inductance @ Frequency
    100µH @ 100kHz
  • Footprint
    0.709 L x 1.024 W (18.00mm x 26.00mm)
  • Chipset Manufacturer
    -
  • Voltage - Auxiliary
    -
  • Intended Chipset

    In a computer system, a chipset is a set of electronic components in an integrated circuit known as a "Data Flow Management System" that manages the data flow between the processor, memory and peripherals. It is usually found on the motherboard. Chipsets are usually designed to work with a specific family of microprocessors. Because it controls communications between the processor and external devices, the chipset plays a crucial role in determining system performance.

    -
  • Height Seated (Max)
    0.404 (10.25mm)
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