Cooper Bussmann F60C500V1/8A

Fuse Size / Group

5AG Midget (10.3 mm x 38.1 mm)

Unit Weight

0.016000 oz

Factory Pack QuantityFactory Pack Quantity

15

Part # Aliases

F60C500V1-8A

Manufacturer

Eaton

Brand

Bussmann / Eaton

RoHS

N

Series

F60C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Hi-Rel Fuse

Subcategory

Fuses

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Hi-Rel Fuse

Product

Specialty Fuses

Product Category

a particular group of related products.

Specialty Fuses

Length

1.5 in

Diameter

0.41 in