Cooper Bussmann 00-001-035-32/J

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Unit Weight

0.016000 oz

Factory Pack QuantityFactory Pack Quantity

100

Part # Aliases

BS00-001-035-32-J

Manufacturer

Eaton

Brand

Bussmann / Eaton

RoHS

N

Series

pushPIN™

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Subcategory

Enclosures, Racks and Boxes

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.790 (20.00mm)

Thermal Resistance @ Forced Air Flow

4.72°C/W @ 100 LFM

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Enclosures, Boxes, & Cases

Thermal Resistance @ Natural

--

Power Dissipation @ Temperature Rise

--

Product Category

a particular group of related products.

Enclosures, Boxes, & Cases

Width

1.772 (45.00mm)

Length

1.772 (45.00mm)

Diameter

--