Comchip Technology MMST3904-G

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

3000

Package Description

SMALL OUTLINE, R-PDSO-G3

Package Style

SMALL OUTLINE

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Rohs Code

Yes

Transition Frequency-Nom (fT)

300 MHz

Manufacturer Part Number

MMST3904-G

Turn-on Time-Max (ton)

70 ns

Package Shape

RECTANGULAR

Number of Elements

1

Part Life Cycle Code

End Of Life

Ihs Manufacturer

COMCHIP TECHNOLOGY CO LTD

Turn-off Time-Max (toff)

300 ns

Risk Rank

5.69

Series

MMST3904

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

MouseReel

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PDSO-G3

Configuration

SINGLE

Transistor Application

SWITCHING

Polarity/Channel Type

NPN

Collector Current-Max (IC)

0.2 A

DC Current Gain-Min (hFE)

60

Collector-Emitter Voltage-Max

40 V