Comchip Technology MMBT5551-G

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

3000

Package Description

SMALL OUTLINE, R-PDSO-G3

Package Style

SMALL OUTLINE

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

30

Rohs Code

Yes

Transition Frequency-Nom (fT)

100 MHz

Manufacturer Part Number

MMBT5551-G

Package Shape

RECTANGULAR

Number of Elements

1

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

COMCHIP TECHNOLOGY CO LTD

Risk Rank

7.87

Series

MMBT5551

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

MouseReel

JESD-609 Code

e3

Type

RF Bipolar Power

Terminal Finish

TIN

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PDSO-G3

Configuration

SINGLE

Transistor Application

SWITCHING

Polarity/Channel Type

NPN

Transistor Type

Bipolar Power

Collector Current-Max (IC)

0.6 A

DC Current Gain-Min (hFE)

50

Collector-Emitter Voltage-Max

160 V