Comchip Technology CDBFR0230L

Factory Lead Time

10 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

1005 (2512 Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Base Part Number

CDBFR0230

Case Code (Metric)

2512

Case Code (Imperial)

1005

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

30μA @ 10V

Voltage - Forward (Vf) (Max) @ If

500mV @ 200mA

Max Reverse Leakage Current

30μA

Operating Temperature - Junction

125°C Max

Max Surge Current

Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

1A

Max Reverse Voltage (DC)

30V

Average Rectified Current

Mainly used to characterize alternating voltage and current. It can be computed by averaging the absolute value of a waveform over one full period of the waveform.

200mA

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant