Package / Case
SOT-23-3
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Number of Terminals
3
Transistor Element Material
SILICON
RoHS
Details
Mounting Styles
SMD/SMT
Transistor Polarity
NPN
Collector- Emitter Voltage VCEO Max
45 V
Emitter- Base Voltage VEBO
5 V
Maximum DC Collector Current
500 mA
Pd - Power Dissipation
300 mW
Gain Bandwidth Product fT
100 MHz
Minimum Operating Temperature
- 65 C
Maximum Operating Temperature
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
+ 150 C
DC Collector/Base Gain hfe Min
160
DC Current Gain hFE Max
400
Factory Pack QuantityFactory Pack Quantity
3000
Unit Weight
0.000282 oz
Package Description
SMALL OUTLINE, R-PDSO-G3
Package Style
SMALL OUTLINE
Package Body Material
PLASTIC/EPOXY
Reflow Temperature-Max (s)
NOT SPECIFIED
Rohs Code
Yes
Transition Frequency-Nom (fT)
100 MHz
Manufacturer Part Number
BC817-25-G
Package Shape
RECTANGULAR
Number of Elements
1
Part Life Cycle Code
End Of Life
Ihs Manufacturer
COMCHIP TECHNOLOGY CO LTD
Risk Rank
6.22
Series
BC817-25
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
MouseReel
Terminal Position
DUAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
compliant
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PDSO-G3
Configuration
Single
Transistor Application
AMPLIFIER
Polarity/Channel Type
NPN
Collector Base Voltage (VCBO)
50 V
Collector Current-Max (IC)
0.5 A
DC Current Gain-Min (hFE)
160
Continuous Collector Current
500 mA
Collector-Emitter Voltage-Max
45 V