Comchip Technology BAV99-G

Factory Lead Time

10 Weeks

Package / Case

TO-236-3, SC-59, SOT-23-3

Mounting Type

Surface Mount

Mount

Surface Mount

Supplier Device Package

SOT-23-3

Published

2002

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

225mW

Base Part Number

BAV99

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

2.5μA @ 70V

Voltage - Forward (Vf) (Max) @ If

1.25V @ 150mA

Operating Temperature - Junction

-55°C~150°C

Max Surge Current

Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

500mA

Voltage - DC Reverse (Vr) (Max)

70V

Current - Average Rectified (Io)

215mA DC

Max Reverse Voltage (DC)

70V

Average Rectified Current

Mainly used to characterize alternating voltage and current. It can be computed by averaging the absolute value of a waveform over one full period of the waveform.

215mA

Reverse Recovery Time

6 ns

Diode Configuration

1 Pair Series Connection

Recovery Time

6 ns

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant