Cinch Connectivity Solutions Midwest Microwave CPL-5212-20-SMA-79

Factory Lead Time

9 Weeks

Package / Case

SMA In-Line Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SMA-F

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

50W

Construction

COAXIAL

Frequency

2GHz~4GHz

Power - Max

50W

RF/Microwave Device Type

DIRECTIONAL COUPLER

VSWR-Max

1.15

Insertion Loss (dB)

0.2 dB

Input Power-Max (CW)

46.99dBm

Coupler Type

Standard

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

20dB ± 1dB

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant