Cinch Connectivity Solutions Johnson 130-0303-001

Factory Lead Time

8 Weeks

Contact Materials

Beryllium Copper

Contact Sizes

8

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

130

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Coaxial

Contact Type

Coax Pin, Socket Center

Contact Finish

Gold

Contact Termination

Crimp, Solder

Wire Gauge or Range - Coaxial

RG-174

Contact Finish Thickness

50.0μin 1.27μm Inner 10.0μin 0.25μm Outer