MS3112E8-2SW

Cinch Connectivity Solutions MS3112E8-2SW

Part No:

MS3112E8-2SW

Datasheet:

-

Package:

INT-A-PAK (3)

AINNX NO:

33893889-MS3112E8-2SW

Description:

Products specifications
  • Mounting Type
    Chassis Mount
  • Package / Case
    INT-A-PAK (3)
  • Supplier Device Package
    Module
  • Current - Average Rectified (Io) (per Diode)
    165A
  • Series
    --
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Base Part Number
    KD166
  • Speed
    Standard Recovery >500ns, > 200mA (Io)
  • Diode Type
    Standard
  • Current - Reverse Leakage @ Vr
    20mA @ 1200V
  • Voltage - DC Reverse (Vr) (Max)
    1200V
  • Diode Configuration
    1 Pair Series Connection
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