Chip Quik, Inc. TS991SNL500T4

RoHS

Details

Alloy

Sn96.5/Ag3.0/Cu0.5

Package Type

Jar

Contains Lead

No

Factory Pack QuantityFactory Pack Quantity

1

Description/Function

Synthetic No-Clean

Package

Bulk

Base Product Number

TS991S

Mfr

Chip Quik Inc.

Product Status

Active

Series

CHIPQUIK®

Type

Paste, No Clean

Composition

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

-

Size

500 g

Shelf Life

12 Months

Shelf Life Start

Date of Manufacture

Form

Jar, 17.64 oz (500g)

Process

Lead Free

Melting Point

423°F (217°C)

Flux Type

No-Clean

Product

Solder

Mesh Type

Tetrahedron, Pyramid, Triangular prism, Hexahedron

4

Diameter

-