Central Semiconductor Corp 2N3819

Factory Lead Time

6 Weeks

Package / Case

TO-226-3, TO-92-3 (TO-226AA)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Weight

453.59237mg

Transistor Element Material

SILICON

Number of Elements

1

Operating Temperature (Max.)

150°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2001

JESD-609 Code

e0

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.21.00.95

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

360mW

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

not_compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

O-PBCY-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

DEPLETION MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

360mW

Transistor Application

AMPLIFIER

Drain to Source Voltage (Vdss)

25V

Transistor Type

N-Channel JFET

Continuous Drain Current (ID)

20mA

Gate to Source Voltage (Vgs)

25V

Drain Current-Max (Abs) (ID)

0.02A

FET Technology

JUNCTION

Feedback Cap-Max (Crss)

4 pF

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant