FVE4ASMR100TQFVC

BPM Microsystems FVE4ASMR100TQFVC

Part No:

FVE4ASMR100TQFVC

Manufacturer:

BPM Microsystems

Datasheet:

SOCKETS_web.pdf

Package:

-

AINNX NO:

69665701-FVE4ASMR100TQFVC

Description:

SOCKET CARD 100 PIN TQFP

Products specifications
  • For Use With/Related Products
    4240-FP2900-ND, 4240-FP2900L-ND, 4240-FP1710-ND, 4240-FP2710-2-ND
  • Series
    Socket
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Retail Package
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Module/Board Type
    Socket Module - 100-TQFP
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