Bourns Inc. BSDW20G120C2

Package / Case

TO-247-3

Mounting Type

Through Hole

Supplier Device Package

TO-247

Current - Average Rectified (Io) (per Diode)

20A

Base Product Number

BSDW20

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Current - Reverse Leakage @ Vr

50 µA @ 1200 V

Voltage - Forward (Vf) (Max) @ If

1.6 V @ 10 A

Operating Temperature - Junction

-55°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

1200 V

Diode Configuration

1 Pair Common Cathode