BOPLA 35170016

Package / Case

QFN

Material

Plastic, ABS

Product Depth (mm)

5(mm)

Operating Temp Range

-40C to 85C

Mounting Styles

Surface Mount

Package

Bag

Mfr

Bopla Enclosures

Product Status

Active

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BoPad

Size / Dimension

6.496 L x 3.543 W (165.00mm x 90.00mm)

Color

White

Pin Count

a count of all of the component leads (or pins)

4

Screening Level

Industrial

Design

Hand Held, Cover Included

Container Type

Box

Area (L x W)

22.8in² (147cm²)

Features

-

Product Length (mm)

7(mm)

Height

1.339 (34.00mm)

Thickness

0.512 (13.00mm)

Product Height (mm)

0.9(mm)

Material Flammability Rating

-

Ratings

IP40