BI Technologies OPV315F

Number of Pins

3

Manufacturer

LITE-ON SEMICONDUCTOR CORP.

RoHS

Y

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

SOT-363

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

250 µW

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

20 mA

Wavelength

850 nm