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BI Technologies OP760C
Part No:
OP760C
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
46850727-OP760C
Description:
Lat. Tm Phototrans. W/ 2M Rbe Sensor Chip Molded Black
Products specifications
- RoHSCompliant
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
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