BI Technologies D103C

Mount

Through Hole

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Pins

10

Diode Element Material

SILICON

Number of Terminals

10

RoHS

Compliant

Package Description

R-PSIP-T10

Package Style

IN-LINE

Moisture Sensitivity Levels

NOT SPECIFIED

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

125 °C

Rohs Code

Yes

Manufacturer Part Number

D103C

Power Dissipation (Max)

0.2 W

Package Shape

RECTANGULAR

Manufacturer

TT electronics / BI Technologies

Number of Elements

5

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

BI TECHNOLOGIES CORP

Forward Voltage-Max (VF)

1.5 V

Risk Rank

5.38

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

JESD-609 Code

e4

Pbfree Code

Yes

Terminal Finish

SILVER

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

80 °C

Min Operating Temperature

-25 °C

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

JESD-30 Code

R-PSIP-T10

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SEPARATE, 5 ELEMENTS

Diode Type

RECTIFIER DIODE

Output Current-Max

0.1 A

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

1.2 V

Peak Non-Repetitive Surge Current

300 mA

Non-rep Pk Forward Current-Max

0.3 A

Reverse Current-Max

1 µA

Reverse Recovery Time-Max

0.004 µs

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No