BeStar Technologies, Inc. BMS1813F-11C-08H4.5-BBS152

Shape

Rectangle

Material - Cone

Polyester, Polyethylene Terephthalate (PET)

Material - Magnet

Nd-Fe-B

Frequency-Self-Resonant

850Hz

Series

BMS

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

0.709" L x 0.512" W (18.00mm x 13.00mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Termination

Solder Pads

Type

General Purpose

Impedance

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

8 Ohms

Power - Max

1 W

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

0 Hz ~ 20 kHz

Power - Rated

700 mW

Port Location

Top

Efficiency - dBA

93.00

Efficiency - Type

Sound Pressure Level (SPL)

Efficiency - Testing

700mW/100mm

Height Seated (Max)

0.177" (4.50mm)