Bel Fuse Inc. SI-52004-F

Mounting Type

Through Hole

Housing Material

Thermoplastic

Shield Material

Copper Alloy

Contact Materials

Copper Alloy

Series

MagJack? ST SI-50000

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Termination

Solder

Connector Type

RJ45

Applications

10/100 Base-T, AutoMDIX, Power over Ethernet (PoE)

Number of Rows

1

Orientation

90° Angle (Right)

Shielding

Shielded, EMI Finger

Contact Finish

Gold

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

1

LED Color

LEDs produce different colors by using various materials which produce photons at different wavelengths.

Green - Yellow

Tab Direction

Up

Number of Cores per Jack

4

Features

Board Guide

Contact Finish Thickness

50.0μin (1.27μm)

Height Above Board

0.550" (13.97mm)