AVX QB1111B40WYC

Material

Beryllium Oxide

Shape

Square

RoHS

Non-Compliant

Package

Tray

Base Product Number

QB1111

Mfr

American Technical Ceramics

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

Q-Bridge

Tolerance

1 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

20 ppm/°C

Type

Thermal Bridge Jumper

Resistance

11.5 Ω

Composition

Wirewound

Color

-

Power Rating

1 W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1 W

Lead Length

38.1 mm

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

0.001 %

Usage

Heat Transfer

Shelf Life

-

Adhesive

-

Storage/Refrigeration Temperature

-

Shelf Life Start

-

Backing, Carrier

-

Outline

1.27mm x 1.27mm

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

153W/m-K, 340W/m-K

Features

Military, Moisture Resistant

Thermal Resistivity

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

4°C/W, 7°C/W

Width

2.16 mm

Length

6.35 mm

Thickness

0.0402 (1.020mm)

Lead Free

Contains Lead