ATP Electronics, Inc. AF120GSSCJ-MAAXP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Package Style

UNCASED CHIP

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40

Operating Temperature-Max

85

Package Code

DIE

Package Shape

RECTANGULAR

Technology

CMOS

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

JESD-30 Code

R-XUUC-N

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

uPs/uCs/Peripheral ICs Type

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

Host Data Transfer Rate-Max

61

Host Interface Standard

ATA