U6032B-MFP

Atmel (Microchip Technology) U6032B-MFP

Part No:

U6032B-MFP

Package:

SOIC

AINNX NO:

10951618-U6032B-MFP

Description:

Products specifications
  • Mount
    Surface Mount
  • Package / Case
    SOIC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • JESD-609 Code
    e0
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125°C
  • Min Operating Temperature
    -40°C
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Supply Voltage
    13.5V
  • JESD-30 Code
    R-PDSO-G8
  • Number of Outputs
    1
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    AUTOMOTIVE
  • Supply Current-Max (Isup)
    2mA
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free
    Contains Lead
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