U3760MB-MFNG3

Atmel (Microchip Technology) U3760MB-MFNG3

Part No:

U3760MB-MFNG3

Datasheet:

-

Package:

-

AINNX NO:

32834950-U3760MB-MFNG3

Description:

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    44
  • Manufacturer Part Number
    U3760MB-MFNG3
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    TEMIC SEMICONDUCTORS
  • Package Description
    SSO-44
  • Risk Rank
    5.69
  • Operating Temperature-Max
    75 °C
  • Operating Temperature-Min
    -25 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Number of Functions
    1
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-PDSO-G44
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL EXTENDED
  • Telecom IC Type
    TELEPHONE MULTIFUNCTION CIRCUIT
  • Make-break Ratio
    2:3
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