Atmel (Microchip Technology) MCP6009-E/ST

Package / Case

TSSOP-14

Mounting Styles

SMD/SMT

Supply Voltage-Max

5.5 V

GBP - Gain Bandwidth Product

1 MHz

SR - Slew Rate

1.9 V/us

Vos - Input Offset Voltage

1.6 mV

Supply Voltage-Min

1.8 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 125 C

Ib - Input Bias Current

1 pA

CMRR - Common Mode Rejection Ratio

90 dB

en - Input Voltage Noise Density

25 nV/sqrt Hz

Development Kit

MCP6421

Gain V/V

1 V/V

In - Input Noise Current Density

0.6 fA/sqrt Hz

Ios - Input Offset Current

1 pA

PSRR - Power Supply Rejection Ratio

95 dB

Factory Pack QuantityFactory Pack Quantity

96

THD plus Noise

0.0025 %

Vcm - Common Mode Voltage

Negative Rail - 0.3 V to Positive Rail + 0.3 V

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Output Type

Rail-to-Rail

Number of Channels

4 Channel

Operating Supply Current

5 mA

Input Type

Rail-to-Rail

Output Current per Channel

30 mA

Product

Operational Amplifier

Shutdown

No Shutdown