ATECC608B-TNGTLSU-C

Atmel (Microchip Technology) ATECC608B-TNGTLSU-C

Part No:

ATECC608B-TNGTLSU-C

Datasheet:

-

Package:

UDFN-8

AINNX NO:

31276258-ATECC608B-TNGTLSU-C

Description:

Security ICs / Authentication ICs LoRaWAN CryptoAuthentication DeviceView in Development Tools Selector

Products specifications
  • Package / Case
    UDFN-8
  • RoHS
    Details
  • Supply Voltage-Max
    5.5 V
  • Supply Voltage-Min
    2 V
  • Minimum Operating Temperature
    - 40 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Mounting Styles
    SMD/SMT
  • Interface Type
    I2C
  • Maximum Clock Frequency
    1 MHz
  • Memory Types
    SRAM
  • Factory Pack QuantityFactory Pack Quantity
    100
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Operating Supply Current
    2 mA
  • Supply Current-Max
    14 mA
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    1 Mb/s
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