AT68166HT-YS20-E

Atmel AT68166HT-YS20-E

Part No:

AT68166HT-YS20-E

Manufacturer:

Atmel

Datasheet:

-

Package:

-

AINNX NO:

33822434-AT68166HT-YS20-E

Category:

Memory Cards

Description:

16Mbit 512Kx32 SRAM MCM,5V Tol,20ns Prot - Bulk (Alt: AT68166HT-YS20-E)

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    68
  • Lead Free Status / RoHS Status
    --
  • Package Description
    GQFF,
  • Package Style
    FLATPACK, GUARD RING
  • Number of Words Code
    512000
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -55 °C
  • Access Time-Max
    20 ns
  • Operating Temperature-Max
    125 °C
  • Manufacturer Part Number
    AT68166HT-YS20-E
  • Number of Words
    524288 words
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Package Code
    GQFF
  • Package Shape
    SQUARE
  • Manufacturer
    Atmel Corporation
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    ATMEL CORP
  • Risk Rank
    5.68
  • Usage Level
    Military grade
  • Series
    *
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    FLAT
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    S-PQFP-F68
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Supply Voltage-Min (Vsup)
    3 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Organization
    512KX32
  • Seated Height-Max
    4.7 mm
  • Memory Width
    32
  • Memory Density
    16777216 bit
  • Screening Level
    MIL-STD-883
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    STANDARD SRAM
  • Total Dose
    300k Rad(Si) V
  • Width
    24.14 mm
  • Length
    24.14 mm
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