AP1014AEC

Asahi Kasei Microdevices/AKM AP1014AEC

Part No:

AP1014AEC

Datasheet:

-

Package:

16-UFBGA, WLCSP

AINNX NO:

69855153-AP1014AEC

Description:

IC HALF BRIDGE DRVR 1.1A 16WLCSP

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    16-UFBGA, WLCSP
  • Supplier Device Package
    16-WLCSP (1.96x1.96)
  • Base Product Number
    AP1014
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -30°C ~ 150°C (TJ)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Applications
    General Purpose
  • Voltage - Supply
    2.7V ~ 5.5V
  • Interface
    Logic
  • Output Configuration
    Half Bridge (4)
  • Voltage - Load
    2V ~ 7V
  • Current - Output / Channel
    1.1A
  • Fault Protection

    Protection against electric shock under. single fault conditions.

    Over Temperature, UVLO
  • Rds On (Typ)
    350mOhm LS + HS
  • Current - Peak Output
    2A
  • Load Type
    Inductive
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