APA501-60-007

Artesyn Embedded Power APA501-60-007

Part No:

APA501-60-007

Package:

-

AINNX NO:

3058994-APA501-60-007

Category:

Accessories

Description:

HEATSINK (60)57.2X89X12MM LO PRO

Products specifications
  • Factory Lead Time
    16 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Box
  • Published
    1996
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Construction
    FIN
  • Reach Compliance Code
    unknown
  • Accessory Type
    Heat Sink
  • Profile
    PIN FIN ARRAY
  • Height
    11.6mm
  • Length
    89mm
  • Width
    57.5mm
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