Aptina ESD7481MUT5G

Package / Case

X3-DFN

Mounting Styles

Surface Mount

Rad Hardened

No

Operating Temperature Min Deg. C

-40C

Operating Temperature Max Deg. C

125C

Number of Elements

1

Suppressor Type

TVS

Direction Type

Bi-Directional

Product Depth (mm)

0.36(MAX)(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Pin Count

a count of all of the component leads (or pins)

2

Working Voltage

3.3

Configuration

Single

Leakage Current

0.05

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

0.25(W)

Clamping Voltage

12

Response Time-Max

1(ns)

Product Length (mm)

0.66(MAX)(mm)

Product Height (mm)

0.28(mm)