AF24BC16-SI

Aplus Flash Technology Inc AF24BC16-SI

Part No:

AF24BC16-SI

Package:

-

AINNX NO:

68721154-AF24BC16-SI

Category:

Memory

Description:

EEPROM

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Material
    double-sided foil fiberglass FR4 type 1.6 mm
  • Number of Terminals
    8
  • Part Life Cycle Code
    Contact Manufacturer
  • Ihs Manufacturer
    APLUS FLASH TECHNOLOGY INC
  • Package Description
    SOP, SOP8,.25
  • Number of Words
    2048 words
  • Number of Words Code
    2000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    SOP
  • Package Equivalence Code
    SOP8,.25
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE
  • Gross weight
    44.50
  • Transport packaging size/quantity
    28.5*21*19/200
  • Contact pitch
    2.54 mm
  • ECCN Code
    EAR99
  • Type
    Prototype board type ECSD
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.51
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Depth
    160 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-PDSO-G8
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Configuration
    spacing between D-SUB25 interface holes: 2.84 mm x 1.38 mm
  • Supply Current-Max
    0.003 mA
  • Organization
    2KX8
  • Memory Width
    8
  • Standby Current-Max
    0.000003 A
  • Memory Density
    16384 bit
  • Parallel/Serial
    SERIAL
  • Memory IC Type
    EEPROM
  • Serial Bus Type
    I2C
  • Endurance
    1000000 Write/Erase Cycles
  • Data Retention Time-Min
    100
  • Write Protection
    HARDWARE
  • I2C Control Byte
    1010MMMR
  • Features
    OSP coating - protection of copper surface from oxidation
  • Width
    100 mm
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