API Delevan Inc. BF3024

Factory Lead Time

8 Weeks

Mount

Free Hanging

Mounting Type

Free Hanging

Package / Case

200

Material

API-1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BF

Published

2010

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Round

Design

Hinged (Snap On)

Impedance @ Frequency

103Ohm @ 100MHz

Outer Dimension

1.200 Dia (30.50mm)

Length

0.945 24.00mm

Diameter - Inner

0.449 Dia (11.40mm)

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free