API Delevan 6495-036

Mounting Type

Chassis Mount

Factory Pack QuantityFactory Pack Quantity

25

Manufacturer

TE Connectivity

Brand

TE Connectivity / DEUTSCH

RoHS

N

Package

Bulk

Mfr

API Delevan Inc.

Product Status

Obsolete

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

-

Size / Dimension

79.38mm L x 52.39mm W

Type

Laminated Core

Subcategory

Circular Connectors

Termination Style

Solder, Quick Connect

Voltage - Isolation

4000Vrms

Current - Output (Max)

Parallel 2.4A, Series 1.2A

Power - Max

43VA

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Circular MIL Spec Backshells

Voltage - Primary

115V, 230V

Primary Winding(s)

Dual

Center Tap

In electronics, a center tap (CT) is a contact made to a point halfway along a winding of a transformer or inductor, or along the element of a resistor or a potentiometer.

No

Voltage - Secondary (Full Load)

Parallel 18V, Series 36V

Secondary Winding(s)

Dual

Product Category

a particular group of related products.

Circular MIL Spec Backshells

Height Seated (Max)

68.26mm